3/9/2024 0 Comments Tweaking solder reflow profile2013 IEEE 19th International Symposium for Design and Technology in Electronic Packaging (SIITME).ī. Factors influencing the formation of voids in chip component solder joints. Pantazică, M., Svasta, P., Wohlrabe, H., & Wolter, K. 2008 58th Electronic Components and Technology Conference. Reliability of Pb-free solder alloys in demanding BGA and CSP applications. Toleno, Effects of reflow profile and thermal conditioning on intermetallic compound thickness for SnAgCu soldered joints. Zhu, The thermal cycling reliability of copper pillar solder bump in flip chip via thermal compression bonding. Lee, Optimizing the reflow profile via defect mechanism analysis. Lau, Recent advances and new trends in flip chip technology. 2015 IEEE 65th Electronic Components and Technology Conference (ECTC). 14 nm chip package interaction development with Cu pillar bump flip chip package. 2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC), 291–296. Voids Reduction in Fine Pitch SiP assembly through optimization of reflow parameters. C., Sutiono, S., Senthil, B., Tim Tiam, K. 2011 12th International Conference on Electronic Packaging Technology and High Density Packaging Copper pillar bump technology progress overview. Yin, Optimization of reflow soldering temperature curve based on genetic algorithm. Kim, Effect of reflow temperature on the mechanical drop performance of Sn-Bi solder joint. IPC-A-610G, “Acceptability of Electronic Assemblies”. Abdullah, Influence of copper pillar bump structure on flip chip packaging during reflow soldering: a numerical approach. Abd Malek, Wettability study of lead free solder paste and its effect towards multiple reflow. Zhang, The melting characteristics and interfacial reactions of Sn-ball/Sn-3.0Ag-0.5Cu-paste/Cu joints during reflow soldering. 2019 IEEE 69th electronic components and technology conference (ECTC). 7nm Chip-package interaction study on a fine pitch flip chip package with laser assisted bonding and mass reflow technology. Jantunen, Effect of voids on thermomechanical cracking in lead-free Sn3Ag0.5Cu interconnections of power modules. Thermo-Compression Bonding for fine-pitch copper-pillar flip-chip interconnect-tool features as enablers of unique technology. Corning, solid logic technology: versatile, high-performance microelectronics. Kuo-Ning, Reliability analysis and design for the fine-pitch flip chip BGA packaging. Lin, Copper pillar bump design optimization for lead free flip-chip packaging. Green IC packaging: Reinventing the integrated circuit is more than just a lead-free issue. Best Practices Reflow Profiling for Lead-Free SMT Assembly.Ĭannis, J. Takyi, Investigation of the effects of reflow profile parameters on lead-free solder bump volumes and joint integrity. Additional experiment that investigates flux outgassing rate of different flux activity levels and the influence of component standoff height and mis-alignment offset towards solder-creeping defect were conducted in this article.Į.H. The experiment was conducted by varying the reflow profile parameter which are ramp rate, soak time and time above liquidus, which the solder joint cross section and X-ray images were then analysed to study its influences. Therefore, in this paper, ramp rate, soak time and time above liquidus of reflow profiles for die utilizing copper pillar bumps with SAC305 as its solder material was studied and optimized in finding the recommended range of each parameter of the reflow profiles that yield the least voiding in the solder joint. If the reflow profile is not properly optimized, defects such as voids in the solder joint can pose a reliability issue for the packaged unit. The quality of the solder joint is influenced by the parameters that govern the reflow profile, which are ramp rate, soak time, time above liquidus time, peak temperature and cooling rate. The dies were mounted onto the substrate by undergoing mass reflow process where the SAC305 solder from the copper pillar bumps and substrate bumps will melt together and solidify to form a solder joint. This led to the invention of copper pillar bumps which acts as a connection between the dies to its corresponding substrate, which allows the fabrication of smaller semiconductor devices. The current trend of electrical devices development is progressing towards miniaturization, multi-function and high density, device integration and fine pitch in a smaller package size.
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